你的位置:首頁 > 白皮書 > 下載

Thermal & Reliability Study on High Current Thermal Vias & Output Pins應(yīng)用指南

文件來源:SynQor
文件類型:pdf
更新時(shí)間:2011-02-18
文件大?。?84K
This application note addresses concerns raised with regards to pin and board heating when high currents (>60A) are driven through thermally relieved plated through hole (PTH) vias. Detailed thermal analysis will show that internal heat generation and resulting temperature rise of the power converter and load board is minimal when using a single thermally relieved via.
本文鏈接:http://coahr.cn/power-dl/521
特別推薦
技術(shù)文章更多>>
技術(shù)白皮書下載更多>>
熱門搜索
?

關(guān)閉

?

關(guān)閉